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Tenders

1
Request for proposal from India-based Event Management Company for providing Event Management Services for AI Impact Expo 2026 to be held in February 2026
Tender Reference No.:
GEM/2025/B/6803814
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

Rs. 50,00,000/-

Pre-Bid Meeting details:

To be held in online mode.
Meeting Link: https://stpi.webex.com/meet/stpihqvc
 

Other Tender Documents:

2
Re-Tender: EXPRESSION OF INTEREST (EOI) FOR ONBOARDING OF SI (SYSTEM INTEGRATOR)/ OPERATORS FOR THE INSTALLATION, OPERATIONS AND MAINTENANCE OF INFRASTRUCTURE FOR TELECOM FIXED/MOBILE COMMUNICATION, WEATHER SENSING AND MONITORING, DISASTER MANAGEMENT ETC
Tender Reference No.:
2025_DIT_875860_2
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

No EMD Required

EoI for Si (system integrator)/ operators for the installation, operations and maintenance of infrastructure for telecom fixed/mobile communication, weather sensing and monitoring, disaster management etc.applications on turnkey basis at STPI-GGN

Other Tender Documents:

3
Supply, Installation, Testing, Commissioning and Training of Network Devices (Layer-3 Distribution Switches, and Layer-2 Distribution Switches)
Tender Reference No.:
GEM/2025/B/6742802
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

INR 10,00,000/-

STPI invites Tender under Two Bid Systems (Technical Bid & Commercial Bid) for Supply, Installation, Testing, Commissioning and Training of Network Devices (Layer-3 Distribution Switches, and Layer-2 Distribution Switches) at various STPI Locations as mentioned in the Annexure-A of the RFP document.

Pre-Bid Queries Responses (dated: 10-10-2025)

Other Tender Documents:

4
EXPRESSION OF INTEREST (EOI) FOR ONBOARDING OF SI (SYSTEM INTEGRATOR)/ OPERATORS FOR THE INSTALLATION, OPERATIONS AND MAINTENANCE OF INFRASTRUCTURE FOR TELECOM FIXED/MOBILE COMMUNICATION, WEATHER SENSING AND MONITORING, DISASTER MANAGEMENT ETC APPLICATION
Tender Reference No.:
2025_DIT_875860_1
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Bid Opening Date:

Tender EMD (Earnest money deposit)

Expression of Interest , No EMD Required

STPI INVITES EOI FROM ELIGIBLE SI, SYSTEM INTEGRATOR/ OPERATORS FOR THE INSTALLATION, OPERATIONS AND MAINTENANCE OF INFRASTRUCTURE FOR TELECOM FIXED/MOBILE COMMUNICATION, WEATHER SENSING AND MONITORING, DISASTER MANAGEMENT ETC APPLICATIONS ON TURNKEY BASIS AT STPI-GURUGRAM, JAIPUR AND JODHPUR Centres.
Last Date & Time of Submission: 29.09.2025 (up to 17:00 Hrs)
Mode of Bid Submission :Online (https://eprocure.gov.in)
EoI Details : The detailed EOI document may be downloaded from https://gurugram.stpi.in/ and https://eprocure.gov.in/eprocure/app.

Tender ID: 2025_DIT_875860_1

Other Tender Documents:

5
RFP for Selection of an Agency for conducting events and mentoring for startups across India
Tender Reference No.:
STPI/HQ/TECH/NGI/SSL/2023-24/1
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

The Bidder shall submit a Bid Securing Declaration as per APPENDIX-D

Online e-Tender at CPP Portal:
(https://eprocure.gov.in/eprocure/app)

Tender ID CPP Portal: 2024_DIT_833643_1

Clarification to Queries (dated 14-Nov-2024)

Other Tender Documents:

6
Hiring of Consulting Agency for Creation of Report on the current Landscape of Electronics/Electro-optics product design and development in India
Tender Reference No.:
GEM/2024/B/5632878
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

EMD Amount: Rs 60000

Corrigendum for date extension - Bid extended to 2024-12-07 17:00:00 

Corrigendum Bid Document

Other Tender Documents:

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